CAPABILITIES

Based on the wide variety of skills and capabilities offered by the xVI team and our access to a broad range of fabrication facilities, we are able to provide our clients with an extensive

Engineering & Integration:

• Complete Process Review & Design for Manufacture (DFM)
• (more)

Nanofabrication:

• Lithography (E-Beam, Optical)
• Wet & Dry Etch (RIE, DRIE, ICP RIE)
• Deposition (Evap., Sputtering, LPCVD, PECVD)
• Focused Ion Beam (FIB) milling & CMP
• Advanced Packaging:
• Device Hybridization (Integrated & Flip Chip)
• Engineered Substrates
• Bonding (Wafer, Die & Wire)
• Integrated Circuits (Photonic & 3D Interconnects)
• (more)

Thermal Management:

• Computational Fluid Dynamics (CFD)
• Cooling Integrated Devices
• Micro-Channel Coolers (MCC)
• CTE Matched Materials & Diffusion Bonding
• (more)

Precision Machining & Assembly:

• Precision CNC Milling & Turning
• Advanced Materials
• Precision Wire EDM
• Fabrication & Assembly
• (more)