ADVANCED PACKAGING

Stud Bumping
xVI can stud bump up to 12" diameter wafers at up to 15 stud-bumps per second.

Accuracy:               ±5.0µm
Ball Height:            ±2.5µm (Coining optional)
Ball Diameter:         ±2.0µm
Minimum Pitch:       ±83µm


Wire Bonding
xVI offers state of the art repeatable automatic die attach and wire bond manufacturing for your most challenging assemblies. With high speed automatic material handling and custom fixturing, we can automate any of your process requirements and meet your quality standards and delivery schedules.

Ball - Automatic gold ball bonding from .0007" to .002" with Bond Process Control

Bond Area:            300mm X 200mm
Accuracy:              ±5.0µm
Minimum Pitch:      83µm
Loop Height:          150µm (Minimum Consistent)
Substrate Size:      300mm X 216mm (Maximum)

Wedge - Automatic aluminum/gold wire bonding from .001" to .003".   45º/90º Feed with Bond Process Control
                 - Heavy Wire aluminum from .004" to .024"

Bond Area:             300mm X 200mm
Accuracy:               ±5.0µm
Minimum Pitch:       80µm
Loop Height:           75µm (Minimum Consistent)
Substrate Size:       300mm X 216mm (Maximum)


Die Attach
xVI provides automatic epoxy dispense or transfer stamp and component placement from wafer or waffle pack.

Bond Area:            300mm X 152mm
Accuracy:              ±50µm
Substrate Size:      400mm X 152mm (Maximum)