xVI offers liquid-cooled heat sinks for applications requiring high heat flux cooling and ultra-low thermal resistance.  By integrating partner provided Normal Flow Cold Plates (NCP™) and their design methodology, xVI's integrated design can cool devices dissipating as much as 1,000 W/cm ² with a cold plate surface temperature increase of only 20 ° C and a pressure drop of less than 20 kPa (3 psi).
This technology has been applied to the cooling of:

• Power Electronics (e.g. IGBTs)
• High Intensity LED Lamps
• Solid State Lasers
• Concentrated Photovoltaic Receivers (CPV)
• Semiconductor Test Equipment
• High Power Microprocessors
• Thermoelectrics